國際研討會議程表
Symposium Programs
2007.5.10 ~2007.5.11
World Trade Center Meeting Room 2F
Free Admission

5/10 5/11 Room Room 3 Room 4 Room 2 Room 3 Room 5 Morning Opening & opening keynote 台北國際半導體產業展開幕典禮 IP Assembly, Packaging & Testing Visual-Audio Products & Technology Seminar Room Room 5 Room 3 Room 2 Room 3 Room 5 Afternoon Global Market Trend IC Design EDA Tool Manufacturing Visual-Audio Products & Technology Seminar

請於下表勾選欲參加之場次，本次研討會免費參加，座位有限，避免向隅，請提早登錄報名。 【研討會講義及收費】每主題均備有講義，如有需要請於研討會報到處購買  > 台灣半導體協會會員；TSIA Member NT$200/ session  > 台北市電腦公會會員；TCA Member NT$200/ session  > 2007 SemiTech Taipei參展廠商；Exhibitors NT$200/ session  > 其他；Other NT$500/ session

2007.5.10  (Taipei World Trade Center 2F；Room 3、Room 5) Room 3、Room4 Opening & Keynote Speech Time Topic Speaker 10:00-11:30 Opening & Opening keynote 台北國際半導體產業展開幕典禮 Mr. Yukio Sakamoto President & CEO Elpida Memory, Inc. Room 5 Room 3 Global Semiconductor Market Outlook 全球半導體市場發展趨勢展望研討會 EDA Tool Time Topic Speaker Time Topic Speaker 13:00-13:30 報到 Registration 13:00-13:30 報到 Registration 13:30-13:40 Global Semiconductor Market Outlook Opening C.K. Lin, Chair of TSIA Information Committee /VP of Winbond 13:30-13:40 EDA Tool Opening Dr. GK Ma, ITRI/STC 馬金溝 副主任, 工研院系統晶片中心 13:40-14:30 Keynote Speech WW semiconductor trend and M&A opportunity of Japanese semiconductor vendors Akira Minamikawa, VP Of iSuppli Japan Research 13:40-14:20 Keynote -EDA Trend & Outlook (Tentative), Lung Chu, Cadence Asia Pacific Operations President, Corporate Vice President 14:30-15:10 PC Market Outlook Bill Gerould, Director of Microsoft World-wide Manufacturing Industry 14:20-15:00 The Coming Challenges for the IC Design & EDA Mr. Jeff Liu, Synopsys Sales Manager 劉進輝總監 15:10-15:30 休息 Break 15:00-15:20 休息 Break 15:30-16:10 Communication Market Outlook – Service on Enabling Mobile Devices Dr. Matthias Ludwig, VP and Managing Director of Infineon 15:20-16:00 Save Verification Cost by Using Visibility Enhancement Technology Thomas Li, Springsoft, Sr. Marketing Manager 16:10-16:50 Consumer Market Outlook -The Ubiquitous Logic NVM- its emerging applications and market trends Rick Shen, Division Director of eMemory Technology Inc. 沈士傑處長 力旺電子 16:00-16:40 Approaches to Sip Design Mr. Kenji Yamamoto General Manager of Zuken Japan Sales Department   16:40-17:20 ESL - Embracing the differences is key to design success Stewart Li/ Mentor Graphics 亞太區資深產品技術顧問

2007.5.11  (Taipei World Trade Center 2F；Room 2、Room 3) Room 2 Room 3 IP Assembly, Packaging & Testing Time Topic Speaker Time Topic Speaker 09:00-09:30 報到 Registration 08:30-09:00 報到 Registration 09:00-09:40 IP Opening Dr. Yee-Wei Huang Chair of IP Task Force of TSIA IC Design Committee, VP of Realtek 09:00-09:40 The rising of China and the challenge to assembly house Mr. Sunil K. Banwari /Intel Director 09:40-10:20 Keynote Speech Managing Intellectual Property in Business: Creating Competitive Diversity and Social Benefit Kent Baker, VP, Director Global IPR Policy & Compliance QUALCOMM Incorporated 09:40-10:20 從晶片整合角度看封測業未來 Mr. ED Chen / tsmc Senior Director 10:20-10:40 休息 Break 10:20-10:40 休息 Break 10:40-11:20 Intellectual Property Management and Strategies. Chris Chou, IP lawyer of K&L Gates 10:40-11:20 Assembly Technology of System in Package：Current and the Future Mr. Leonardo Wang /ASE Director 11:20-12:00 What to do when the Troll knocks Jeffrey Van Myers, Legal Consultant of AMD 11:20-12:00 SiP Design Challenge Mr. Tom Kao-Lo/ Cadence Manager Manufacturing IC Design 無線數位家庭與行動通訊同步應用設計研討會 Time Topic Speaker Time Topic Speaker 13:00-13:30 報到 Registration 13:00-13:30 報到 Registration 13:30-14:10 Challenges of 300mm Fab Full Automation Dr. Chih-kuo Liang / ProMos Director 13:30-13:40 IC Design Opening Cheng-Wen Wu, Chair / TSIA IC Design Committee/General Director of STC, ITRI 14:10-14:50 How To Become Process Winner Mr. Teddy Lin / PSC Director 13:40-14:30 Trend on Wireless Communications - Wi-Fi to Wi-Max Longsong Lin, General Manager / Intel Innovation Technologies Ltd 林榮松 英特爾創新科技總經理 14:50-15:10 休息 Break 14:30-14:50 休息 Break 15:10-15:50 Technology integration & 3D packaging Mr. Sebastian Shyi-Ching Liau / ITRI Director 14:50-15:30 Small is Beautiful: From the Desktop to UltraMobility Richard Brown, VP, Corporate Marketing / VIA 15:50-16:30 Perspectives on the Si IC process technology development Mr. Mike Ma/ UMC Deputy Division Director 15:30-16:10 A Perfect Digihome – Aspects from System to SoC ASUS 華碩電腦   16:10-16:50 Multimedia Broadcasting for Wireless Home – Challenge and Opportunity Rick Jeng, Executive VP/ Ralink 鄭雙徽 雷凌科技執行副總

Visual-Audio Products & Technology Seminar 影音產品與壓縮技術研討會 2007.5.11  (Taipei World Trade Center 2F； Room 5) Room 5 Visual-Audio Products & Technology - Morning Time 公司名稱 Topic Speaker 10:00-10:20 報到 Registration 10:20-10:30 開幕 Opening 10:30-11:00 NXP 恩智浦半導體 NXP Home Media Device Solutions-- Media Processor and Digital Photo Frame 恩智浦家庭娛樂產品之影音技術解決方案 Tim Chen 陳石明， Senior System Marketing Manager, BU Home, Greater China, NXP Semiconductors 恩智浦半導體 大中華區資深市場行銷經理 11:00-11:30 Qpixel Technology 微點科技股份有限公司 Ultra low power Main Profile H.264 silicon solutions for portable consumer devices and digital home applications Kourosh Amiri, Vice President, Marketing 11:30-12:00 TI 德州儀器 數位家庭影音產品發展趨勢 TI Digital Home Lifestyle Jefferey Chiu,Ph.D.曲建仲 博士 Visual-Audio Products & Technology - Afternoon Time 公司名稱 Topic Speaker 13:00-13:30 Avant Technology 宏太科技 Celoxica's Rapid Image Processing Solution 石羽中 Chong Seki, Manager 王雅雯 Wenny Wang, Application Engineer 13:30-14:00 Macpower & Tytech Technology 原形研發股份有限公司 DiGiTAL SIGNAGE SOLUTION 陳嗣添 / Tommy Chen CEO 14:00-14:30 ITRI 工研院電光所 視窗多媒體解碼器硬體模組 吳國瑞博士 14:30-15:00 Hantro 如何選擇手持式SoC中之視訊解壓縮技術 How to choose a good multi-format video codec IP for mobile device SoC. Sami Hyyrylainen, Worldwide Sales VP 15:00-15:30 ChipIdea The total solution for Audio Codec. Sales Division Business Development Manager Joyce Chen 陳惠蘭 15:30-16:00 資訊工業策進會 網路多媒體研究所 III H.264 Suite Introduction 何文楨 主任 16:00-16:30 New Epoch Technology 新時代科技 多核心DSP+多核心CPU+FPGA 嵌入式整合SOC解決方案 Jonathan Huang 黃世蔚總經理